SK hynix launches Indiana chip packaging hub for first US-made HBM

SK hynix on Thursday formally launched its $3.87 billion advanced chip packaging project in Indiana, a facility set to produce the first high bandwidth memory made in the US. The groundbreaking ceremony was held at Purdue University in West Lafayette, Indiana, more than two years after SK hynix announced the investment in April 2024.

The plant is expected to complete its clean room in October 2028 and begin mass production in the third quarter of 2029.

Once operational, the facility will take DR