SK hynix holds groundbreaking ceremony for HBM production base in US

South Korean chipmaker SK hynix on Thursday held a groundbreaking ceremony for an advanced packaging production facility for artificial intelligence memory in Indiana, aiming to produce hundreds of thousands of wafers annually there.

The ceremony took place at Purdue University in West Lafayette, as the tech giant is forging ahead with plans to establish its first next-generation High Bandwidth Memory production hub in the United States, with a total investment estimated at over $4 billion.

HBM

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SK Hynix expands US presence with HBM plant

SK hynix open to US investment, sees memory shortage through 2030 The Korea Herald — Aug 28, 05:32 AM
(LEAD) SK hynix holds groundbreaking ceremony for HBM production base in U.S. Yonhap News Agency — Aug 28, 00:06 AM
SK Hynix weighs closer ties with Japan’s memory industry The Japan Times — Aug 28, 05:40 AM